Reducing recalls and minimising waste are key themes for Mettler Toledo at food summit

Oct 5, 2017 | Food Processing & Packaging

Applying inspection technology to reduce product recalls, minimize food waste and improve overall operational efficiency are key themes being addressed by Mettler-Toledo Product Inspection at the Food & Drink IT Summit on 7 November 2017 in Coventry, UK.

The company is fielding two key speakers across three seminars and representatives will also be available on stand H7 throughout the day to help delegates with any aspect of food inspection and its benefits.

This event brings together everyone involved in the food production supply chain. It’s a really great opportunity to engage with food and beverage manufacturers, food retailers and food service companies in order to understand the challenges they are facing and demonstrate how inspection technology can make a positive contribution to their business,” says Russell Morgan, Product Inspection Sales Manager for UK & Ireland.

As part of the Dairy Summit, Russell will explore the issue of product recalls. Risk of recalls is on the rise as production speeds increase and manufacturers are under more pressure than ever to deliver higher volumes of product. Add to this the growing trend to run varieties of a single product on the same production line and the opportunities for error are multiplied.  Drawing on 15 years experience, Russell will explain how product inspection technologies are evolving to help manufacturers minimize instances of product contamination and ensure consistent quality of product: protecting the welfare of the consumer and their own brand reputations.

Russell will again take centre stage as part of the Meat & Seafood Summit: this time to present a seminar called “Metal Detection, X-ray, Or Both?”, which will consider the key advantages and disadvantages of each inspection technology and help attendees to make better investment decisions to safeguard the quality and safety of their products.

Meanwhile colleague Lee Smith, Lead Software Engineer at Mettler-Toledo for the last seven years, is participating in his capacity as Co-Chairman of the OMAC Packaging Workgroup. As part of the IT Summit, Lee will give a high level overview of PackML, explaining how it provides standards-based monitoring, control and integration capabilities for production machinery. He will also provide a practical example of implementing PackML across a range of product inspection solutions, including checkweighing, metal detection, vision and x-ray inspection systems.

To get involved in the conversation about preventing waste and contamination, ensuring safety and improving operational efficiency in the food manufacturing industry, join us at #MTinsidefood on Twitter or sign up to our blog at http://www.mt-product-inspection.com/

For more information about Mettler-Toledo Product Inspection’s products and services for the food manufacturing industry follow us on Twitter (@MettlerToledoPI) or LinkedIn or visit www.mt.com/pi and YouTube.